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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Mentor Webinar: Getting Your Design Done Fast and Right
August 6, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
“Do you want that design done fast or do you want it right?”
You’ve probably heard that expression before, and probably had a chuckle. That’s just the way it is, right?
Webinar presenters Don Kost and Pat McGoff of Valor say, “Have it both ways!” They invite you to check out their on-demand webinar “Optimize New Product Introductions — Going Fast, Right or Both.”
Attendees will learn how DFM software lets designers check to ensure manufacturability—of both the fabricated board and the assembled product—as your design progresses.
This webinar will explain:
- How DFM decisions impact yield, cost, and reliability of your designs
- How DFM tools help you optimize your designs for manufacturing
- How running DFM software embedded with EDA software facilitates better designs faster
Who should attend:
- PCB design managers and designers
- DFM and NPI engineers
- Manufacturing engineers
- Supplier quality engineers
To view this on-demand webinar, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
12/13/2024 | ROHMROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.
Keysight Joins Intel Foundry Accelerator United States Military, Aerospace and Government Alliance
12/13/2024 | Keysight Technologies, Inc.Keysight Technologies, Inc. announced it has joined the Intel Foundry Accelerator United States Military, Aerospace and Government (USMAG) Alliance..
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”