Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Advanced Assembly Adds a New, High-Tech Selective Solder Line
August 11, 2020 | Advanced AssemblyEstimated reading time: 1 minute
Advanced Assembly, the pioneers of the quick-turn PCB assembly services, announced the installation of its new selective solder machine, the Juki iCube. This new robust system provides the company with a unique ability to perform selective soldering on through-hole mounted components faster and with more repeatability than before.
The Juki iCube selective soldering system is a complete all-in-one solution with extensive features designed for high-end, high-quality production. For PCB designs with through-hole components distributed across the board, selective soldering provides the ability to target individual pins as opposed to exposing the entire PCB to a wave soldering process.
“This brand-new selective solder technology gives us the ability to place through-hole components on the type of sophisticated designs commonly used in the avionics, aerospace, and defense industries,” said Greg Ziraldo, Advanced Assembly’s Senior Director of Operations. “For our customers, this new solution means faster turn-times on repeat designs and more precise through-hole assembly.”
Additionally, Advanced Assembly has completed the expansion of its Colorado-based manufacturing facility. The additional 6,000 square feet have been used to expand the company’s SMT and Receiving departments and increase the production space for improved manufacturing flow.
“Speed matters to engineers developing new products for the electronics market,” said Lawrence Davis, Advanced Assembly’s President and CEO. “The faster they can get PCB prototypes back for testing and verification, the faster they can move into final production runs. We know this. It’s why we are constantly implementing innovative processes and new equipment that reduce turn-times. Every minute counts in today’s highly competitive world.”
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.