Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference
August 18, 2020 | MacDermid Alpha Assembly DivisionEstimated reading time: 2 minutes
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting two technical papers; “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” and “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Voiding is an area of concern for the long-term durability and functionality of electronic devices. Voids near or at the interface of surface mount technology (SMT) component input/outputs (I/O’s), or the circuit board substrate can be highly probable initiators of crack propagation, leading to the high possibility of a field failure. Voids are also very good insulators of heat, leading to thermal issues with heat sinks and thermal pads often used in power devices. The paper “Methods of Reducing or Eliminating Voids in BGA and BTC Devices” will focus on discussing both laboratory and field data and is aimed at circuit assembly engineers and designers who need to minimize voiding in tin lead and lead-free assemblies.
Traditionally, hole fill requirements in types II and III assemblies had required the use of silver bearing lead-free alloys during wave soldering. As a result of continuous alloy developments, an opportunity now exists to employ a silver free lead-free alloy that can meet such hole fill requirements. The second paper, “Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?” will focus on sharing basic performance, limits, and strategic opportunities of the ALPHA® SnCX Plus 07 silver free alloy. Data is provided to help manufacturers keen on further savings to identify suitable Type II and even Type III assemblies for technical evaluations.
For more information on Alpha’s void reduction solutions and the ALPHA SnCX Plus 07 silver free alloy, please visit MacDermidAlpha.com.
SMTA South China Technology Conference
Date: 26th August 2020 – 27th August 2020
Venue: Booth 1A80, Hall 1, Shenzhen Conventional & Exhibition Center, Shenzhen, China
Presented By: William Yu, Senior Technical Services Manager, MacDermid Alpha Electronics Solutions
1st Topic: Methods of Reducing or Eliminating Voids in BGA and BTC Devices
Date: 26th August 2020 (Wednesday)
Time: 13:45-14:20
2nd Topic: Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?
Date: 27th August 2020 (Thursday)
Time: 11:15-12:30
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Suggested Items
Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025
03/13/2025 | AismalibarAismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).
Global Sourcing Spotlight: How Global Sourcing Drives Innovation
03/12/2025 | Bob Duke -- Column: Global Sourcing SpotlightSomeone once told me the more you meet and work with people, the more you’ll learn and, most importantly, the more it will spur more innovation. Innovation is, of course, the lifeblood of success. Companies constantly seek ways to stay ahead, remain competitive, and deliver value to their customers.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.
Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing
03/10/2025 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG. Sartorius is a leading international provider to the biopharmaceutical research and medical industry.