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EMA Design Automation Hosts 'High Density' Webinar
August 19, 2020 | EMA Design AutomationEstimated reading time: Less than a minute
EMA Design Automation hosts a free webinar entitled “High Density Interconnect—Addressing Complex and Dense PCB Designs,” from 2-3 p.m. EDT Thursday, Aug. 27.
This webinar will focus on ways to overcome common challenges with high density interconnect when designing a small and complex PCB.
Attendees will learn:
- What is High Density Interconnect?
- Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.
- Challenges to consider when implementing HDI during the electrical and manufacturing stages
- Basic HDI Design Guidelines
Visit EMA online to register
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January 2025 Issue of Design007 Magazine: The Designer of the Future
01/13/2025 | I-Connect007 Editorial TeamAs we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like for the next generations?
The Shaughnessy Report: The Designer of Tomorrow
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Focus on electronica: Future Challenges From a Designer’s Viewpoint
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