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EMA Design Automation Hosts 'High Density' Webinar
August 19, 2020 | EMA Design AutomationEstimated reading time: Less than a minute
EMA Design Automation hosts a free webinar entitled “High Density Interconnect—Addressing Complex and Dense PCB Designs,” from 2-3 p.m. EDT Thursday, Aug. 27.
This webinar will focus on ways to overcome common challenges with high density interconnect when designing a small and complex PCB.
Attendees will learn:
- What is High Density Interconnect?
- Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.
- Challenges to consider when implementing HDI during the electrical and manufacturing stages
- Basic HDI Design Guidelines
Visit EMA online to register
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