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EMA Design Automation Hosts 'High Density' Webinar
August 19, 2020 | EMA Design AutomationEstimated reading time: Less than a minute
 
                                                                    EMA Design Automation hosts a free webinar entitled “High Density Interconnect—Addressing Complex and Dense PCB Designs,” from 2-3 p.m. EDT Thursday, Aug. 27.
This webinar will focus on ways to overcome common challenges with high density interconnect when designing a small and complex PCB.
Attendees will learn:
- What is High Density Interconnect?
- Reasons to consider including HDI in your next PCB design such as tight component space constraints, fine pitch BGAs and signal performance.
- Challenges to consider when implementing HDI during the electrical and manufacturing stages
- Basic HDI Design Guidelines
Visit EMA online to register
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Brent Fischthal - Koh YoungSuggested Items
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Industry Veteran Dr. Helen Song Joins Celera Semiconductor to Lead Product Design
10/28/2025 | PRNewswireCelera Semiconductor, the analog industry leader using AI to automate the entire product development flow, today announced that Dr. Helen Song has joined the company as vice president of Product Design.
Mapping the EV Landscape: Markets, Platforms, and Powertrains
10/28/2025 | Stanton Rak, SF Rak Companye-Mobility is the defining transformation of 21st-century transportation. As legacy OEMs, startups, and governments race to electrify vehicle fleets, the landscape of e-Mobility is expanding into previously unimaginable territory. But with innovation comes complexity, and with complexity, a need for systems that are not only high-performing but also reliably engineered for the long haul. Understanding the diversity and scale of the EV marketplace is essential to grasping the reliability challenges ahead.
Cadence Reports Q3 2025 Financial Results
10/28/2025 | Cadence Design Systems, Inc.Revenue of $1.339 billion, compared to revenue of $1.215 billion in Q3 2024

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Designers Notebook: Power and Ground Distribution Basics
                                         Designers Notebook: Power and Ground Distribution Basics Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
                                         Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
                                         Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling





 
                     
                 
                    