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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Mentor Hosts Design Tool for Rigid-Flex Circuits Webinar
August 20, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
“What Technology Should Your PCB Tool Have To Design Rigid-flex Circuits Properly?” is the topic for a webinar hosted by Mentor, A Siemens Business, from 2 to 3 p.m. EDT, Tuesday, Aug. 25.
Today, electronic design companies are meeting consumer form-factor demands and ensure high reliability and flexibility in design options for products using flex/rigid-flex circuits. Designing these rigid-flex PCB’s requires a design tool with advanced technologies distinctly unique to flex/rigid-flex design. From flex/rigid-flex centric operations and capabilities that understand the unique structures, constraints, plane management, materials, stack-ups, and beyond, PADS Professional has the features and operations necessary to support flex/rigid-flex design that other tools don’t.
Presenters are Brent Klingforth, a technical marketing engineer specializing in schematic, PCB and manufacturing products; and John McMillan, technical marketing engineering manager.
You will learn:
- Requirements for Flex design
- Where arced and rounded structures are required
- How to design a proper stack-up
- Intelligent overlapping flex regions
- Automation specific to Flex design
- Proper design technique for flexible circuits
- How to incorporate Flex and Rigid-Flex designs into your product
- Automated features allowing you to dramatically reduce design time
Visit pads.com to register.
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Brent Fischthal - Koh YoungSuggested Items
Professors from Cornell University and University of Michigan to Be Honored for Excellence in Semiconductor Research
11/07/2025 | SIASIA and SRC present the University Research Awards annually to professors who demonstrate excellence in advancing research in semiconductor technology and design.
CELUS, NextPCB Establish Strategic Partnership to Accelerate AI-Driven Electronics Design and Manufacturing
11/07/2025 | BUSINESS WIRECELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production.
Siemens, NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
11/07/2025 | SiemensAt the NVIDIA GTC (GPU Technology Conference) in Washington, D.C., Siemens and NVIDIA demonstrated a new technology stack currently in development for the Siemens Xcelerator portfolio.
Everyone’s Talking About Power
11/06/2025 | Heidi Barnes, Keysight TechnologiesDelivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.