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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Mentor Hosts Design Tool for Rigid-Flex Circuits WebinarAugust 20, 2020 | Mentor, a Siemens business
Estimated reading time: Less than a minute
“What Technology Should Your PCB Tool Have To Design Rigid-flex Circuits Properly?” is the topic for a webinar hosted by Mentor, A Siemens Business, from 2 to 3 p.m. EDT, Tuesday, Aug. 25.
Today, electronic design companies are meeting consumer form-factor demands and ensure high reliability and flexibility in design options for products using flex/rigid-flex circuits. Designing these rigid-flex PCB’s requires a design tool with advanced technologies distinctly unique to flex/rigid-flex design. From flex/rigid-flex centric operations and capabilities that understand the unique structures, constraints, plane management, materials, stack-ups, and beyond, PADS Professional has the features and operations necessary to support flex/rigid-flex design that other tools don’t.
Presenters are Brent Klingforth, a technical marketing engineer specializing in schematic, PCB and manufacturing products; and John McMillan, technical marketing engineering manager.
You will learn:
- Requirements for Flex design
- Where arced and rounded structures are required
- How to design a proper stack-up
- Intelligent overlapping flex regions
- Automation specific to Flex design
- Proper design technique for flexible circuits
- How to incorporate Flex and Rigid-Flex designs into your product
- Automated features allowing you to dramatically reduce design time
Visit pads.com to register.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.