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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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TSK Schill GmbH Delivers New OSP Line to Unimicron Germany
August 25, 2020 | TSK Schill GmbHEstimated reading time: 1 minute
Despite the difficult conditions during the lockdown in the phase of COVID-19, TSK Schill GmbH succeeded in keeping to the tight project schedule and supplying Unimicron Germany GmbH with its new "Höllmüller by TSK" systems on time by working closely with its suppliers.
By investing in this horizontal OSP line, Unimicron is taking a further step toward the future and is very satisfied with the high precision and quality in organic surface protection.
The extraordinarily good cooperation and planning between Unimicron and TSK made it possible to complete the project successfully.
"We are very proud to be a reliable partner for our customers even in these difficult times and look forward to further joint projects," says Sales Manager Marc Aicheler.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
IPC Standards: The Heart of the Electronics Industry
02/16/2026 | Nolan Johnson, SMT007 MagazineFrom its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.
Defense Speak Interpreted: The New Railgun Is Big News, But Can It Work?
02/10/2026 | Dennis Fritz -- Column: Defense Speak InterpretedJust as I was sitting down to finish this column, President Trump announced two new battleships, each equipped with a railgun. This is not just any railgun; it’s a 32-megajoule, with the same electrical power requirements as I have been reporting to you. Besides that, the battleships will be equipped with laser weapons—again, the ones I discussed in my November column. Both these are electric, not energy-propelled weapons.
India Approves $626 Million in Projects to Boost Electronics Parts Output
11/11/2025 | I-Connect007India’s government approved seven projects on Oct. 27, totaling over 55 billion rupees ($626 million), that will expand the domestic production of electronic parts, Reuters reported.
High Density Packaging User Group Announces European Space Agency Membership
11/04/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.