Happy’s Tech Talk #38: Novel Metallization for UHDI
It’s Only Common Sense Mastering the Follow-Up—The Key to Closing More Deals
Driving Innovation: Registration in PCB Production Throughout the Process
TSK Schill GmbH Delivers New OSP Line to Unimicron Germany
August 25, 2020 | TSK Schill GmbHEstimated reading time: Less than a minute
Despite the difficult conditions during the lockdown in the phase of COVID-19, TSK Schill GmbH succeeded in keeping to the tight project schedule and supplying Unimicron Germany GmbH with its new "Höllmüller by TSK" systems on time by working closely with its suppliers.
By investing in this horizontal OSP line, Unimicron is taking a further step toward the future and is very satisfied with the high precision and quality in organic surface protection.
The extraordinarily good cooperation and planning between Unimicron and TSK made it possible to complete the project successfully.
"We are very proud to be a reliable partner for our customers even in these difficult times and look forward to further joint projects," says Sales Manager Marc Aicheler.
Share on:
Suggested Items
Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership
05/07/2025 | Indium CorporationIndium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.
Honeywell Advances Technology for the European Defense Sector
04/29/2025 | HoneywellHoneywell has received two research grants to execute projects aimed at advancing avionics and cybersecurity capabilities for the European defense sector.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Recognizing the IPC Committee Volunteer Awards in 2025
04/24/2025 | Patty Goldman, I-Connect007In 2023, IPC created two new awards to honor standards development committee volunteers: The Hillman-Lambert Award for Volunteer of the Year and the Kessler-Goldman Award for Committee Leader of the Year. The awards were named after Hall of Fame members whose service to standards development is well-known and who have demonstrated the skills and principles that the awardees should also have.