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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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TSK Schill GmbH Delivers New OSP Line to Unimicron Germany
August 25, 2020 | TSK Schill GmbHEstimated reading time: Less than a minute

Despite the difficult conditions during the lockdown in the phase of COVID-19, TSK Schill GmbH succeeded in keeping to the tight project schedule and supplying Unimicron Germany GmbH with its new "Höllmüller by TSK" systems on time by working closely with its suppliers.
By investing in this horizontal OSP line, Unimicron is taking a further step toward the future and is very satisfied with the high precision and quality in organic surface protection.
The extraordinarily good cooperation and planning between Unimicron and TSK made it possible to complete the project successfully.
"We are very proud to be a reliable partner for our customers even in these difficult times and look forward to further joint projects," says Sales Manager Marc Aicheler.
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