Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
TSK Schill GmbH Delivers New OSP Line to Unimicron Germany
August 25, 2020 | TSK Schill GmbHEstimated reading time: Less than a minute
Despite the difficult conditions during the lockdown in the phase of COVID-19, TSK Schill GmbH succeeded in keeping to the tight project schedule and supplying Unimicron Germany GmbH with its new "Höllmüller by TSK" systems on time by working closely with its suppliers.
By investing in this horizontal OSP line, Unimicron is taking a further step toward the future and is very satisfied with the high precision and quality in organic surface protection.
The extraordinarily good cooperation and planning between Unimicron and TSK made it possible to complete the project successfully.
"We are very proud to be a reliable partner for our customers even in these difficult times and look forward to further joint projects," says Sales Manager Marc Aicheler.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year
07/14/2025 | I-Connect007 Editorial TeamJapan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
ICEFlight to Accelerate Maturation of Cryogenic Technologies for Hydrogen-Powered Flight
05/27/2025 | GKN AerospaceGKN Aerospace is one of the project partners in ICEFlight (Innovative Cryogenic Electric Flight), a project aiming to contribute to the development of hydrogen-powered flight.