Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
ITW EAE Wins Vision Awards for MPM Paste Management System, Electrovert Adjustable Wave
August 26, 2020 | ITW EAEEstimated reading time: 1 minute
ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.
The MPM Paste Monitoring System features temperature monitoring as well as upper and lower limit roll-height monitoring. The paste height monitor is a robust solution that allows the user to monitor the paste roll size during a print stroke. Patent-pending paste temperature monitoring allows paste to be measured in the cartridge or on the stencil. These new features improve yield and reduce waste by ensuring proper paste viscosity to avoid bridging and voiding and eliminate insufficient or excess paste volumes.
The DwellFlex 4.0 variable contact wave solder nozzle is the first wave solder nozzle that allows the wave width to be adjusted on-the-fly as variable board types are run through the wave. The patent-pending design ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds. Intelligent software compares the recipes between the products and adjusts the wave contact length, pump speed rpm, forced convection blower speeds, and fluxer settings on-the-fly as needed. This eliminates lost production time and improves solder results.
As a single wave solution, DwellFlex 4.0 eliminates the temperature drop that occurs between a typical dual wave configuration. A single wave solution improves the nozzle efficiency, promotes better topside hole fill and reduces flux degradation in the soldering process. All these benefits equate to reduced defects and improved line efficiency.
The Vision Awards honor visionary advancements in SMT assembly products and technologies that enable China’s electronics assembly industry to build better, more reliable products. Judging was conducted by a panel of well-known SMT industry experts and SMT China magazine readers. Products were judged on their innovativeness and their contribution in helping the industry reduce costs, improve product quality, increase production efficiencies, and enhance product reliability.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.