Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
Target Condition: Designing vs. Inventing
Dana on Data: The Missing AI-NPI Link
Remcom Announces XFdtd Electromagnetic Simulation Software Update
August 26, 2020 | PR NewswireEstimated reading time: 1 minute
Remcom announces an update to XFdtd® 3D EM Simulation Software, with new features to address 5G millimeter wave antenna design challenges including support for high-performance tuners and singularity correction. In addition, PCB import enhancements save time in the design workflow.
As mobile devices continue to grow in complexity, engineers are challenged to include more antennas in less available space within the device while maximizing efficiency. Multi-port RF devices such as tuners and switches can be utilized to optimize band coverage. To accommodate these innovations, XFdtd's Circuit Element Optimizer (CEO) now includes multi-port device functionality, enabling engineers to incorporate and test these components in their matching network simulations.
Singularity correction is a sophisticated meshing method that accurately captures highly varying electromagnetic fields around the conductive edges of geometries such as antennas or transmission lines. XFdtd adjusts the electric and magnetic field values adjacent to metallic edges during time stepping. For higher frequency and millimeter wave use cases, where numerous antennas and components create high spatial variation of fields, singularity correction can significantly improve accuracy and strengthen confidence in the expected behavior of a device.
The new XFdtd release also includes enhancements to printed circuit board (PCB) import, allowing documentation layers of a PCB to be imported alongside the geometry. These layers typically include useful manufacturer information such as the build date of the device, ID number, and more. Lastly, lumped circuit components specified in ODB++ and BRD files are also imported, eliminating the need to manually add them afterwards.
Share on:
Suggested Items
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
New Cryostatic Systems Elevate Current Research on Qubits
03/31/2025 | Fraunhofer IAFThe Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.
Mazda, ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
03/28/2025 | ROHMMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix™ Platform
03/27/2025 | PRNewswireAnsys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.