Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Remcom Announces XFdtd Electromagnetic Simulation Software Update
August 26, 2020 | PR NewswireEstimated reading time: 1 minute
Remcom announces an update to XFdtd® 3D EM Simulation Software, with new features to address 5G millimeter wave antenna design challenges including support for high-performance tuners and singularity correction. In addition, PCB import enhancements save time in the design workflow.
As mobile devices continue to grow in complexity, engineers are challenged to include more antennas in less available space within the device while maximizing efficiency. Multi-port RF devices such as tuners and switches can be utilized to optimize band coverage. To accommodate these innovations, XFdtd's Circuit Element Optimizer (CEO) now includes multi-port device functionality, enabling engineers to incorporate and test these components in their matching network simulations.
Singularity correction is a sophisticated meshing method that accurately captures highly varying electromagnetic fields around the conductive edges of geometries such as antennas or transmission lines. XFdtd adjusts the electric and magnetic field values adjacent to metallic edges during time stepping. For higher frequency and millimeter wave use cases, where numerous antennas and components create high spatial variation of fields, singularity correction can significantly improve accuracy and strengthen confidence in the expected behavior of a device.
The new XFdtd release also includes enhancements to printed circuit board (PCB) import, allowing documentation layers of a PCB to be imported alongside the geometry. These layers typically include useful manufacturer information such as the build date of the device, ID number, and more. Lastly, lumped circuit components specified in ODB++ and BRD files are also imported, eliminating the need to manually add them afterwards.
Share on:
Suggested Items
QuantumScape, Murata Announce Framework for Ceramics Collaboration
04/25/2025 | BUSINESS WIREQuantumScape Corporation, a global leader in next-generation solid-state lithium-metal battery technology, and Murata Manufacturing Co. have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QS’s solid-state battery technology.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
ASMPT Demonstrates Technology Leadership in SMT Assembly
04/09/2025 | ASMPTThe rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.
Tariff Uncertainty Weighs on Display Demand, Pricing, and the Supply of AMOLED Materials,
04/09/2025 | TrendForceTrendForce reports that the U.S. began implementing reciprocal tariffs on April 9th, based largely on trade deficits. Consequently, Asia—particularly Southeast Asia, a key hub for the consumer electronics supply chain—has been significantly impacted.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.