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Rapid, Real-Time Inspection & Diagnostics from Insituware: Learn More at SMTAI Virtual Expo
August 28, 2020 | Insituware LLCEstimated reading time: 1 minute

Insituware LLC, the provider of the first smart in situ measurement solution with integrated machine learning technology, today announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place September 28-30, 2020. Insituware will discuss its Vision MARK-1 hand-held diagnostic tool. This innovative tool enables rapid, real-time inspection, diagnostics, and process control capabilities.
The Vision product family uses machine learning technology to bring material control solutions right in your hand. Built to last, the Vision product family features expandable modules called “Insights” for a futureproof design, continuously expanding functionality. The first Insight module allows full monitoring and control of solder paste.
Insituware’s mission is to help customers take control of materials to save money, mitigate liability, and gain a competitive edge. The company continues growing and developing new integrations for the Vision MARK-1 to enable the functionality of nonintrusive sensing for new industries.
Insituware revolutionizes the way we control materials. For more information, visit insituware.com.
About Insituware LLC
Insituware is an integrated technology company that enables rapid assessments of materials during use. The technology combines advanced analytical sensors, smart devices and intelligent cloud-based information with innovative packaging methods to enable nonintrusive sensing. For more information, visit insituware.com.
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Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.