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I-Connect007 Releases Exclusive Coverage of 2020 IPC High-Reliability Virtual Forum
September 4, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 proudly announces the release of special event coverage of the 2020 IPC High-Reliability Forum.
The conference, originally planned for May 2020, was rescheduled as a virtual conference in July because of the COVID-19 pandemic. This is the third annual event and, like the past two, continues to grow. The forum focuses on electronics for critical military, aerospace, automotive, and medical applications required to function without interruption for an extended lifetime where downtime is not acceptable.
The summit was thoroughly covered by industry expert Happy Holden, who reports in our special coverage on the broad range of topics related to reliability. He took this opportunity to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximize product reliability.
I-Connect007’s coverage of the summit is packaged in an easy-to-follow format within the September edition of SMT007 Magazine, and soon to be released in the September issue of PCB007 Magazine.
To read this exclusive coverage of the summit, click here and select the September 2020 issue.
I-Connect007 is the most extensive global source for news and original content serving the printed circuit board design, fabrication, and assembly/EMS markets.
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