-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
American Standard Circuits’ New Book Covers Thermal Management From a Fabricator’s Perspective
September 10, 2020 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 3 minutes

I had the opportunity to speak with Anaya Vardya, president and CEO of American Standard Circuits, about The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, which serves as a desk reference for designers on the most current thermal management techniques and methods.
Dan Beaulieu: I just finished reading your new book, and I enjoyed it a great deal. I loved the idea that it is from the fabricator’s point of view, showing the various processes for building thermal management PCBs. With that in mind, why did you write this book on thermal management, and why now?
Anaya Vardya: We have watched with interest as our business for thermal-related PCBs has grown. We have been in this segment of the market for years, doing everything from using the special thermal materials to metal-backed heat sink-type boards. It is definitely a growing market with increased interest. This made us feel it was the right time to provide this book.
Beaulieu: What was your goal in writing this book?
Vardya: Primarily, we wanted to educate our readership when it comes to the various PCB thermal technologies available today. We feel that if we can contribute to the education of our customers, especially the engineers and designers, everything will run more smoothly. We wanted to give our customers insight into what it takes to build a thermal board. In short, the more our customers know about our PCB technology, the better we can work together in the end. We discuss design rules associated with the various different thermal management techniques.
Beaulieu: What is the audience for this book?
Vardya: The book is for professionals who have anything to do with designing PCBs, especially designers and engineers, as well as our customers and people who have an interest in PCBs in general and thermal PCBs specifically.
Beaulieu: What is your background when it comes to thermal management technology?
Vardya: I have been in PCB technology for many years. I have years of experience in thermal management at the various places that I have previously worked at and at ASC.
Beaulieu: Does your company build a lot of thermal management PCBs?
Vardya: We have been steadily growing our thermal PCB business over the past few years. We have a very holistic view of thermal management, providing IMPCB or MCPCB and RF thermal management PCBs. This includes using special materials and processes, as well as building metal-backed boards. We even have three CNC vertical mill three-axis machining centers in-house, plus special plating lines set up to plate the metal in-house, too. This enables us to do all the processing in-house, eliminate outsourcing, and allow us to deliver quick turns on these technologies.
Beaulieu: What is the impetus behind the significant growth in demand for this kind of technology?
Vardya: While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, LED lighting, consumer electronics, and medical sectors.
Beaulieu: You see it growing in the future as well?
Vardya: Without a doubt.
Beaulieu: You and your team have presented a number of technical webinars via Zoom this year. Do you plan on doing one on thermal management anytime soon?
Vardya: Absolutely! We have been waiting to publish this book and planned our thermal management webinars for afterward.
Beaulieu: You have done a number of these micro-eBooks now. Do you have plans to do more in the next few years?
Vardya: We have had very good luck with these books in partnership with I-Connect007. This is our third book, and we have had tremendous success with them. In fact, we are planning on publishing another book this year. We are still deciding on what topic we are going to write about.
Beaulieu: The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective is available for free download today at I-007eBooks.com/thermfab.
Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals. Visit I-007eBooks.com to download these and other free, educational titles.
Suggested Items
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Schweizer Electronic Publishes Group Figures for 2024 and Provides Outlook for 2025
05/01/2025 | Schweizer Electronic AGSCHWEIZER achieved a turnover of EUR 144.5 million in the 2024 financial year (previous year: EUR 139.4 million), the highest consolidated turnover in the company's history.
Siemens, Intel Foundry Advance Collaboration
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging.
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.