-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Additive Electronics TechXchange Keynote Announced
September 10, 2020 | SMTAEstimated reading time: 1 minute
The SMTA announced Jeff Doubrava, Managing Partner, Prismark Partners LLC, will keynote the Additive Electronics Conference on October 15, 2020.
Mr. Doubrava will present “Outlook for Advanced Printed Circuit Board Fabrication - Applications, Technologies and Production” in which he will discuss the applications driving the fabrication of advanced PCB designs and provide current and mid-term views of the production of new designs and fabrication technologies.
Jeff Doubrava is a Managing Partner of Prismark Partners LLC, a 25-person consulting firm active at all levels of the electronics industry. At Prismark, Jeff works with a wide range of companies in areas such as electronic materials, intellectual property assessment, acquisition strategy development, and alternative energy. Prior to joining Prismark, Jeff spent twenty years with Shipley/Rohm and Haas, most recently as Global Business Director for the Printed Wiring Board Materials business. Jeff holds a BA in Chemistry from the University of Rochester and an MBA from Babson College. He holds several US patents for his development of enabling electronic materials.
The Additive Electronics Conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.
“We anticipate a lot of discussion again between attendees and presenters to gain the understanding of all supporting and utilizing this portion of the electronics supply chain,” noted conference co-chair, Lenora Clark. “Last year we learned of multiple different options for creating the circuit on various materials, this year we expect to dive deeper into market trends, usage and where additive fit within low, medium and high-volume production.”
Co-chair Tara Dunn noted, “We are excited to hear from industry experts including academia, telecommunications, US Department of Defense, major OEMs, global suppliers and leading consulting firms to put a more definitive shape to this emerging market segment. We will investigate this portion of manufacture where the electronics industry straddles the line between PCB and IC substrate.”
Registration is open and sponsorship opportunities are available. For full details and to register, visit www.smta.org/additive.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Tablet Market Levels Off in 3Q 2025 Following Six Quarters of Growth Driven by Replacement Demand
11/13/2025 | IDCWorldwide tablet shipments declined 4.4% year-over-year in the third quarter of 2025 (3Q25), totaling 38 million units, according to data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
Innatera Signs Joya as ODM Customer, Bringing Neuromorphic Edge AI into Everyday Connected Products
11/13/2025 | PRNewswireInnatera, the leader in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, today announced that Xiamen Joyatech Co., Ltd. has become its first Original Design Manufacturer (ODM) customer.
Real Time with... productronica 2025: Looking Ahead to productronica, and a Stronger European Electronics Ecosystem
11/13/2025 | Real Time with...productronicaNext week at productronica, the Global Electronics Association Europe will be hosting a full program each day of the show at their booth in Hall A1. Philippe Leonard, head of the Association’s European office, recently shared what’s happening for our industry in Europe, details of the Hand Soldering World Championship at the show, a preview of a new Cable & Wire Harness competition kicking off in 2026, and information about the impressive lineup of speakers at the Electronics Industry Forum at the Association’s booth.
Mexico's Moment in Electronics Manufacturing
11/12/2025 | Lorena Villanueva, Global Electronics Association MexicoOn a weekday morning in the Bajío, Mexico, a training lab reviews accept/reject criteria before a line changeover. By mid-afternoon, a cross-border shipment clears in El Paso that left Ciudad Juárez at dawn. Farther south, a university team finalizes intake for a new electronics pathway blending online modules with factory practicums. These scenes—routine yet transformative—explain whyMexico is becoming the most strategic partner for the United States to ensure a resilient, innovative, and sovereign electronics supply chain in North America.
MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
11/12/2025 | MacDermid Alpha Electronics SolutionsEvery advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.