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DesignCon Changes Dates, Expands Offerings Beyond In-Person Event
September 10, 2020 | Globe NewswireEstimated reading time: 1 minute
DesignCon, North America’s largest chip, board, and systems event, announced the annual conference and exhibition – historically slated for the January timeframe at the Santa Clara Convention Center – will now be held April 13–15, 2021 at the larger Global Biorisk Advisory Council (GBAC) STAR accredited San Jose McEnery Convention Center.
The change in venue provides additional space for DesignCon’s ever-growing technical conference, notably integrating engineering professionals in automotive electronics and intelligence and embedded hardware, software, and IoT from the Drive World and Embedded Systems Conference (ESC) allowing for even more professionals to learn from the experts who present each year.
“The new date and location in San Jose, California is the result of an ongoing strategy to expand and hone DesignCon’s legacy offerings,” said Suzanne Deffree, Group Event Director, DesignCon, organized by Informa Markets. “The larger venue will enable increased exhibiting space, added seating in the popular Chiphead Theater, and curated space for the returning Career Zone, which alone drew in more than 300 attendees in 2020, as well as afford the ability to introduce new programs for the community on a year-long basis.”
To complement DesignCon’s significant role in growing the industry via a mounting roster of qualified attendees across applications, DesignCon recently launched a brand-new “Back-to-School” webinar series with media partner Design News. The five-day educational opportunity is set to take place September 28 – October 2 and will feature some of the highest-rated speakers and session content from DesignCon 2020, which for the first time, is free-to-attend. Speakers include: Amphenol, ANSYS, Intel, JordanDSP.com, Marvell Semiconductor, Samtec, and Teledyne LeCroy.
Deffree continued: “The industry is undergoing the most significant disruption since the conception of Moore’s Law, as the underlying assumptions are undergoing a noteworthy market adaption. The industry needs to remain connected, not just three days a year, but on a constant basis to spur and keep up with market progression. This need for continued education is foundational to our launching the “Back-to-School” webinar series, a program we are excited to offer our community and one we’ll continue to nurture as the industry evolves.”
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SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.