Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
I-007eBook Review: Thermal Management From a Fabricator’s Perspective
September 15, 2020 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 1 minute
The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator’s Perspective, written by Anaya Vardya, founder and CEO of American Standard Circuits, is an important book for a number of reasons. The most important reason is right there in the title; it is from the fabricator’s perspective. Besides explaining all aspects of thermal management—from thermal vias and metal-core boards to mixed technology—this book also describes the various applications of thermal dielectrics, their properties, and their incorporation into the actual fabrication of PCBs.
For those who are, shall we say, “less technical” than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs), and mixed-technology PCBs.
I found the section on thermal impedance and thermal resistance especially useful with their clear and concise definitions of what these terms actually mean. The images and descriptive charts are an integral part of this book, illustrating the properties of various thermal options. Finally, the book’s true value is describing the various processes of each type of thermal technology PCB.
The Printed Circuit Designer’s Guide to Thermal Management… A Fabricator’s Perspective is an excellent book for everyone from our industry’s newest members to the most experienced engineers and even marketing and sales professionals who need a good understanding of thermal management.
This is another great addition to I-Connect007’s library of technical micro-eBooks free for anyone to download. Download your copy today.
Dan Beaulieu is president of D.B. Management Group.
Share on:
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
Safran Invests in mirSense, a French Startup Pioneering Quantum-cascade Lasers
04/30/2025 | SafranSafran, through its Safran Corporate Ventures investment subsidiary, has invested in mirSense, a French startup specializing in quantum-cascade lasers (QCLs).