-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
PCB Manufacturer Ilfa Feinstleitertechnik Invests in New Electrical Test and AOI
September 16, 2020 | ADEON TechnologiesEstimated reading time: 2 minutes
To keep on investing during the pandemic, ILFA Feinstleitertechnik GmbH, PCB manufacturer from Hannover Germany, invests in the latest technology from CIMS and atg-LM.
As a longstanding highTech prototype and serial PCB manufacturer in Germany focusing on offering a wide technology range, ILFA has analysed and conducted the investments as part of an overall factory technology and capability upgrade for manufacturing state of the art printed circuit boards.
The CIMS Galaxy Automatic Optical Inspection and atg-LM Flying Probe Electrical Test systems are supplied by Dutch based distributor and service provider Adeon Technologies BV. The purchase orders are following extensive benchmarking, from which the results proved to ILFA’s management that these are the right products for their ever- increasing technology level and meeting customer demands.
The CIMS Galaxy AOI offers the latest by CIMS parameterized optical inspection technology. The CIMS Galaxy is part of the CIMS SPARK technology, which was introduced in 2013 and has become the PCB Industry’s benchmark together with its sister product the Phoenix. The system allows customers to define their own factory specifications and tolerances. This enables fast set-up and throughput with 100% detectability and clear outcome for operators as well as full statistical control in compliance with Industry 4.0 requirements. The CIMS AOI systems are capable to work with the wide range of base materials and surface finishes that ILFA is capable to offer to its widely spread customer base worldwide.
The atg-LM technology is partially an expansion, and partially a replacement for the atg-LM equipment that has been in use at ILFA for over a decade. Especially with the Model A7, equipped with the latest state of E-Test technology, ILFA can test finer pitch, smaller pads and also every type of surface finish at unrivalled speed. The Model A7 enables ILFA to test embedded components and is prepared for 4-wire testing. The latest probe technology secures ultra-delicate handling of the pads when tested so that every type of surface finish is tested thoroughly, yet non-destructive.
The managing partners at ILFA, Mr. Thomas Michels & Mr. Christian Behrendt, explain their decisions, “The choice for the CIMS AOI and atg-LM secure us of the latest technology, with an open structure for upgrading into the future and enabling to stay ahead in the prototype to mid-volume segment of the more complex PCB manufacturing. Through a long and solid partnership with ADEON Technologies and its service and support, it ended up being a straight forward decision for us.”
Mr. André Bodegom, MD at ADEON Technologies added, “We are proud of having strong and lasting relationships with ILFA as well as our entire customer base. We will never take any purchase order for granted and will always have an open communication link with our customers and suppliers to keep detecting potential improvements at an early stage, whilst trying to offer the lowest cost of operation, service and support. This new step for ILFA has confirmed to us that this philosophy is recognized by market leaders and so we’ll continue this steady course.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.
HFR Accelerates GPU-Based AI-RAN Development with ETRI
05/11/2026 | PRNewswireHFR, Inc., a leading telecommunications equipment provider, announced that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
05/11/2026 | Cadence Design SystemsCadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications.