Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
IPC Statement on NDAA Provisions Aimed at Bringing Resiliency and Security to Supply Chains
September 16, 2020 | IPCEstimated reading time: 2 minutes
IPC, the global association of electronics manufacturers, issued a blog post in support of the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA), the green-and-gold hardwiring at the core of all electronics systems. These provisions, approved in both the U.S. House and Senate, aim to improve the security of electronics purchased by the Defense Department. Excerpts from the blog post argue the following:
“The NDAA provisions aim to improve the security of electronics purchased by the Defense Department by developing an affirmative list of allied, trusted countries from which the DoD can source those boards and assemblies. The United States should not be sourcing electronics for national security systems from countries it deems a current or potential security threat. Nor should any other country, for that matter.
“Today, without this requirement, there are potential national security risks associated with systems that are built with PCBs and PCBAs from sources that are beyond the visibility of the DOD. These risks have been well-documented by the Defense Department and outside experts.
“The opposition fears the new requirements will disrupt their established supply chains in countries that are not affirmatively covered. But the provisions explicitly authorize the Secretary of Defense to add countries to the list of locations from which PCBs and PCBAs can be sourced. And, with over $10 billion of PCB manufacturing today in allied countries and the U.S., there is ample capacity today to meet DoD demand for military and commercial off-the-shelf electronics.
“In addition to down-stream electronics industry support, the provisions have over four dozen supporting members of Congress from both sides of the aisle in the House and the Senate. Not a single member of Congress has risen in opposition.
“Moreover, both the full House and Senate have voted to include these provisions in the bill, so in keeping with committee precedent, the broad parameters of issue are settled.
“The NDAA provisions offer the ancillary, but meaningful, benefit of strengthening supply chain resiliency by growing the market for electronics manufactured in the United States and its allies. In fact, U.S. CEOs have indicated a desire to grow their manufacturing operations in the United States but are hedging for the moment. They are waiting for the passage of the NDAA and the demand signal it will send.”
To read the full blog post, visit IPC.org.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.