-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Altium to Host PCB Industry's Premier Virtual Event
September 23, 2020 | Business WireEstimated reading time: 1 minute
AltiumLive, Altium’s annual flagship printed circuit board (PCB) design conference, is transitioning from a live, three-day event into a virtual summit. The free event is open to all, and meticulously curated to preserve the quality and content the electronic design community has come to expect.
“We’re very excited to deliver our unique AltiumLive experience for the first time ever in a virtual format. As always, we will provide a dynamic approach to learn, network and collaborate - but this time, from the convenience of either your home or workplace,” said Ted Pawela, Altium’s COO. “By making our conference both virtual and free of charge, it will remove the limitations of time, travel, workload, and budget, enabling many more members of the design community to attend.”
Now in its fourth year, AltiumLive coalesces the electronic design community’s best and brightest, featuring luminary keynote speakers, panels and ample opportunity for attendees to network with their peers from all over the world.
This year’s event also features some of the biggest speakers yet, including David Pellarin of Amazon Web Services and Picotest’s Steve Sandler, as well as major fan favorites like Teledyne LeCroy’s Dr. Eric Bogatin, Jeremy Blum, founder of Shaper Tools, and Rick Hartley, president of RH Enterprises.
The three-day event will also include exclusive sessions that can be viewed on-demand, live Q&A sessions, interactive electronics education and networking, daily happy hours, virtual tours of manufacturing facilities and more.
With half-day live events plus optional sessions and activities, attendees will be able to customize their AltiumLive experience, while balancing work-from-home needs.
AltiumLive will be held across six days in October to best accommodate North American and European audiences. The North American dates are October 6-8, 2020; the European dates are October 20-22, 2020.
For more information or to register for the free event, please visit altium.com.
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.