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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 25, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It’s show time! Yes, once again, the trade show season is upon us. But it’s a little bit different this year, with every industry trade show and conference relegated to virtual formats because of COVID-19 travel restrictions.
Virtual shows are the only game in town, and a lot of companies see them as a great opportunity. After all, with a virtual show, anyone in the world can attend and see your latest products. There are no plane tickets, hotel rooms, restaurants, or rental cars to pay for. Do you think the virtual show is here to stay, even after COVID-19 is a thing of the past, or are people getting tired of logging on to these events?
In this week’s picks, we bring you news about the upcoming SMTA International 2020, IPC’s plans for the fall, a move for Burkle North America’s headquarters, and advice on how to select the correct CAD tool. And we have the first installment of our newest series: “Just Ask John Mitchell.”
Next week, Nolan Johnson is back with his top five recommendations.
Visit Real Time with… SMTAI 2020 for Complete Show Coverage
Published September 24
SMTA International gets underway next week, with a virtual exposition scheduled for September 28–30, 2020. We started early, featuring pre-show video interviews with a variety of executives, managers, and engineers in the SMT segment. At I-Connect007, we’ll bring you complete coverage of SMTAI, so check back with Real Time with… SMTAI.
The Government Circuit: Green Regulations, the Economy, COVID-19, and ‘Decoupling’ in Focus for IPC This Fall
Published September 21
Quite a few people read Chris Mitchell’s latest column on the IPC’s plans for the fall. In this article, Mitchell explains how IPC is dealing with everything from EPA regulations and COVID-19 to Asian markets and communicating with your elected officials. Is North America going to continue to “decouple” from China? Mitchell breaks it down.
Burkle North America Announces Headquarters Move to Greensboro Technology Center
Published September 21
Do I detect a trend? One study found that approximately 1,800 businesses left California during 2016, the most recent year with available data. Now, we can add Burkle North America to that list, and who can blame them? By relocating from Cypress, California, to Greensboro, North Carolina, the company will save millions of dollars over time, allowing them to better serve their customers. And the new digs are only a short drive from Research Triangle Park. Good move.
Just Ask John Mitchell: Are IPC’s Positions Dictated by Politics?
Published September 21
After the success of our previous “Just Ask” installments that posed technology and market questions for Happy Holden, Joe Fjelstad, and Eric Camden, we knew it was time to find some “new blood.” Fortunately, IPC President and CEO Dr. John Mitchell was ready and willing to answer your questions. The first question that came in for John had to do with whether IPC’s programs are driven by politics, and in this election year, a lot of you clicked on this article.
Connect the Dots: How to Know If a CAD Tool Is Right for You
Published September 21
In this column, Sunstone Circuits’ Matt Stevenson and Bob Tise discuss some of the lesser-known criteria to consider when selecting a new CAD tool, especially the free and budget-priced tools. This duo digs in and provides tips for selecting and trying out everything from open-source design tools to layout tools provided by PCB fabricators. They also explain why open-source tools are definitely not for everyone.
Suggested Items
IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.