-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E
October 1, 2020 | IPCEstimated reading time: 2 minutes
IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
The IPC D-33AM Task Group developing IPC-6012EM realized that there are two different focuses for electronics in the medical device industry sector: the relatively high-volume production of “standard-sized” printed boards for medical diagnostic equipment applications; and the miniature, high density printed boards for very small devices which are often human body implantable.
“We understand the medical industry utilizes electronics in laser surgical devices, radiation emitting devices, x-ray machines, ultrasound devices and implantables where product failure can result in the high risk of injury to the patient,” noted John Perry, IPC director of printed board standards and technology. “IPC recognized the industry’s desire for more stringent printed board fabrication requirements than can be provided within the current IPC Class 3 Performance class for these types of medical devices. The IPC D-33AM Task Group was created to develop an addendum to the base IPC-6012E printed board performance specification that addresses those technological needs.”
IPC’s family of printed board design standards (IPC-2220 series) and board performance specifications IPC-6010 series) make use of three IPC producibility levels, intended to convey to the end user an increasing cost and sophistication with respect to fabricating printed board features of smaller and smaller size. IPC-6012EM is the first addendum to an IPC specification that makes use of a new design level “D”, which was created to address the miniaturization level of medical devices. This new design level “D” goes beyond the typical feature sizes of what is typically considered “high density interconnect” (HDI) and addresses conductor width/spaces below 60 µm as well as via structures below 100 µm.
Many regulatory requirements provided by both the United States Food and Drug Administration (FDA) and the European Union (EU), help ensure the safety and security of human beings (and animals) with respect to not only human and veterinary drugs and biological products, but also electronic medical devices. Examples include the EU Medical Device Directive, EU Active Implantable Medical Devices Directive and the EU Commission Regulations. As noted by Andres Ojalill, IPC technical staff liaison to the IPC D-33AM Task Group, “IPC-6012EM has been written to streamline the production of high reliability printed boards for medical devices in accordance with regulations mentioned above so that there are no gaps between technical and regulatory requirements.”
For more information on IPC-6012EM, visit ipc.org.
Suggested Items
Airbus Foundation Joins Forces with the Solar Impulse Foundation to Boost Climate Action
03/28/2025 | AirbusThe Airbus Foundation and Solar Impulse Foundation have launched a three-year partnership aimed at driving global progress on sustainability through fostering innovation and collaboration.
LN Phase Modulator, ASE Light Source Module for Fiber Optic Gyroscope
03/26/2025 | POINTekPOINTek, Inc., a global leader and provider of high performance athermal AWG products, announced launching of a new family of aerospace application products: Lithium Niobate Phase Modulator and ASE Light Source Module for Fiber Optic Gyroscope (FOG).
Altair, JetZero Join Forces to Propel Aerospace Innovation
03/26/2025 | AltairAltair, a global leader in computational intelligence, and JetZero, a company dedicated to developing the world’s first commercial blended wing airplane, have joined forces to drive next-generation aerospace innovation.
GKN Aerospace and Partners Successfully Complete ASCEND Programme, Transforming High-Rate Composite Manufacturing
03/21/2025 | GKN AerospaceGKN Aerospace, in collaboration with McLaren Automotive and other UK partners, proudly announces the successful completion of the ASCEND (Aerospace and Automotive Supply Chain Enabled Development) programme.
GKN Aerospace Recognised for Excellence in Safety at GE Symposium
03/17/2025 | GKN AerospaceGKN Aerospace is proud to have been honoured with the Excellence in Safety award at the GE Symposium. Representing our team, Priscilla Camanho and Lars Mattgard accepted the award, recognizing our commitment to maintaining the highest safety standards in the industry.