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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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I-Connect007 Editor's Choice: Five Must-Reads for the Week
October 2, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks.
In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.
If you attended SMTAI, I hope you had a productive time. If you didn’t, then be sure to follow I-Connect007’s post-show coverage next week. View more video interviews and show-related content at Real Time with… SMTAI 2020 virtual.
Real Time with…SMTAI 2020: ASC Makes Lemonade Out of Lemons
September 25, 2020
Steve Williams and Anaya Vardya, president and CEO of American Standard Circuits (ASC), discuss the upcoming virtual SMTAI show and how the company is “making lemonade out of lemons.” There may not be any face-to-face interaction, but virtual shows are open to attendees from around the world with no travel or hotel costs. Anaya explains how the COVID-19 lockdown has caused ASC to become more creative in its marketing efforts, including holding webinars and publishing two eBooks with I-Connect007. They also discuss ASC’s holistic approach to the marketplace, with a diversified product mix across various segments.
Real Time with...SMTAI 2020: MacDermid Alpha’s Single-Step Metalization Paper
September 30, 2020
One of the MacDermid Alpha Electronics Solutions’ technical papers from SMTAI details a new process for filling through-holes with copper in a single step. Carmichael Gugliotti, the primary author and an applications specialist, and Richard Bellemare, director of electrolytic metalization, address why this new process matters and what’s in Gugliotti’s technical paper presentation for SMTAI. To view Gugliotti’s paper presentation, log on to the SMTAI technical sessions before October 31, 2020.
Real Time with...SMTAI 2020: Creative Electron Moves Toward Autonomous Systems
October 1, 2020
Andy Shaughnessy recently spoke with Dr. Bill Cardoso, CEO of Creative Electron, a provider of advanced X-ray inspection systems. Bill discusses some of the new technologies the company would be demonstrating in its virtual booth at SMTAI, including a next-generation X-ray parts counter and a new software platform that offers better automation than ever. He also explains the company’s plan to migrate from automation to autonomous systems by using AI to help remove humans from the process.
Twenty Companies Join New Industrial Digital Twin Association
September 28, 2020
The aim of this new association is to bring together all of the parallel development strands working toward the industrial digital twin and to develop it as an open-source solution together with member companies. Users benefit from the early insights into the digitization of industrial products. This reduces effort, integration time, and costs in the own value creation.
NK Technologies Increases Capacity by Trading up With Manncorp
September 25, 2020
NK Technologies, a developer and manufacturer of innovative current-sensing products, recently improved their manufacturing capacity by participating in Manncorp’s Trade In, Trade Up Program. Learn more about this program.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.