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Pentalogix and Ucamco Announce Release of Pentalogix’s Gerber X3 Output
October 6, 2020 | PentaLogixEstimated reading time: Less than a minute
Tualatin, Oregon-based Pentalogix, which has been working closely with Gerber format developers Ucamco for years, had already successfully implemented Gerber X2. They now follow suit with the implementation of component layer output. The component layer output has been fully verified by Ucamco, who confirm it conforms to the X3 specification.
A team of people in CAD, CAM and EMS developed Gerber X3 with a single goal in mind: to provide a robust, standardized method for automatically transferring assembly information from design to EMS.
Gerber X2 already fully covered the automatic transfer of information from design to fabrication, in a simple and unequivocal manner. Gerber X3 extends Gerber to assembly, covering the complete EMS process. By using existing syntax and graphics capabilities of X2, Gerber X3 is highly compatible and maintains the trademark simplicity for which Gerber has always been known.
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11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.