-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
EIPC Presents Technical Snapshot Webinars
October 6, 2020 | EIPCEstimated reading time: 1 minute
During the Autumn of this year, EIPC will be organising three webinars which will be of particular interest to those involved with automotive, telecom and high-speed technology. We will have three well-known PCB industry speakers, each of whom has their own view on the technology challenges facing this industry.
These webinars will be held on Wednesdays October 14, November 18, and December 16.
They will last for some 45 minutes with each speaker taking 15 minutes for their presentations and then the webinar will be open for questions and comments from the participants. These webinars will be free to EIPC members and € 50 for non-members.
This first session will focus on automotive technology and some of the key factors driving the global Automotive Printed Circuit Board industry. They will look at how the whole supply chain of PCB manufacturing can be ready for that change which will need input on materials, processes, measurement systems, reliability, and environmental impact and are there some new technologies for PCB manufacturing which will support these new demands.
The webinar on 14th of October will start at 15.00 hrs.
Presentations
Lenora Clark from ESI Automotive
Her presentation topic: An exploration of advanced semiconductor packaging’s effect on automotive electronic hardware design and assembly. In the presentation there will be discussion and review on all aspects of the electronic build, starting with how increased performance influences the semiconductor packages, how that then affects design for PCB fabrication, and finally it considers the influence on materials for perfect assembly.
Alun Morgan from Ventec
His presentation topic: "Reliability needs to be designed-in from the lowest level." In the presentation you will hear about cutting-edge technology demands more care to ensure reliability and resilience.
Paul Waldner from Multiline
His presentation topic: "Multilayer Printed Circuit Requirements for the Automobile Industry in the Age of High Speed." In the presentation you will hear some new ideas on multilayer pressing technology and how the registration can be improved to fulfil the demand for tighter tolerances
Registeration is free of charge to EIPC Members. The Non Member fee is € 50.-
To register for October 14, visit eipc.org.
Suggested Items
IDTechEx Report: Illuminating the Future of Lidar in Automotive
05/09/2024 | PRNewswireIn the rapidly evolving landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, sensor technologies have emerged as a pivotal force driving innovations in the automotive industry.
Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024
05/07/2024 | SEMIWorldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.