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Real Time with… SMTAI 2020: Technical Conference Review
October 6, 2020 | Real Time with...SMTAIEstimated reading time: 16 minutes
Dennis Lee, NVIDIA Corporation
#750: Anatomy of the Ongoing Reliability Test (ORT) Process.
Dennis Lee is a Senior Product Reliability Engineer at NVIDIA. Lee outlined the ongoing reliability test (ORT) process and described in detail how it can be implemented in the electronics industry. The process is an extension of the FMEA procedure done in design. The paper provided a comprehensive perspective on how the ORT process can be defined, implemented, and executed.
As the industry’s approach to the ORT process is quite open-ended and inconsistent, a variety of implementations are used that may cause some confusion. The ORT process is presented as a structured and consistent approach, retaining the freedom and flexibility to define the highly customizable process, depending on product needs and quality targets. He explains the purpose, objectives, justification, and value, along with suitable methods of selecting samples and stress regiments of the ORT process. As ORT is often viewed as an optional process, Lee provides a rationale on its applicability and suitability is offered, along with guidance on the implementation decision process.
Figure 14: The ORT process.
Zohair Mehkri, Flex International
#754: How Quantum Computing Will Revolutionize Manufacturing
Mehkri explained quantum computing very simply in 20 minutes. Today's world operates in 0 and 1. This binary phenomenon has allowed for much advancement since the beginning of information technology and computer science. However, as with anything, it has had its limitations.
At a crossroads of quantum physics, computer science, and information theory, a new wave of computing is emerging from the depths of quantum study and computer science labs. Quantum computing has been studied for decades, but advances in modern science have enabled this technology to progress in the last several years more than the decades before it.
Quantum computing, at a very high level, uses qubits instead of bits and allows for multiple states to occur as opposed to just two (0 and 1). This allows for many more possibilities than standard computing. Introducing this concept into manufacturing opens doors that were never thought possible and encourages every company in this space to change computing forever.
This paper explained the concepts of quantum computing, how the technology works, and proceeded to describe its significance in the world of manufacturing, state its advantages and shortcomings, and offer a realistic view of what is perceived to occur. Since quantum computing should be powerful, it will probably be used in the cloud and with AI software.
Figure 15: Quantum computing states.Page 4 of 7
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Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.