Real Time with… SMTAI 2020: Technical Conference Review

Estimated reading time: 16 minutes

#655: Single-Step Metallization Process for the Filling of Through-Holes With Copper Pulse Plating, Through-Holes, Copper-Filled, Thermal Management

Gugliotti’s paper discusses a copper plating process capable of filling through-holes with solid copper in one step for applications, such as core layer through-hole filling with minimal surface copper buildup for HDI technologies and thermal management of heat-sensitive electronics. The advantages of the single-step filling process benefit both the technology and the fabricator regarding the copper through-hole filling for the core.

Figure 19: New single-step through-hole filling.

Partida’s presentation reviewed concerns and reliability testing of micro vias. He provided an overview of the HDI process and presented the use of current test methods and the superiority of testing with IPC-D-coupon and IPC-TM-650 test methods 2.6.7.2 and 2.6.27. He also discussed the warning statement in the forthcoming IPC-6012E (Qualification and Performance Specification for Rigid Printed Boards).

To emphasize his proposition, Partida presented test data from actual orders that showed that only these new IPC standards could detect all latent microvia defects. The higher temperatures of lead-free reflow are the main causes of this type of defect, and only four-wire testing at these temperatures will reveal them.

Figure 20: Detecting latent microvia failures in test.Page 6 of 7

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