Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Real Time with… SMTAI 2020: Technical Conference Review
October 6, 2020 | Real Time with...SMTAIEstimated reading time: 16 minutes
Carmichael Gugliotti, MacDermid Alpha Electronic Solutions
#655: Single-Step Metallization Process for the Filling of Through-Holes With Copper Pulse Plating, Through-Holes, Copper-Filled, Thermal Management
Gugliotti’s paper discusses a copper plating process capable of filling through-holes with solid copper in one step for applications, such as core layer through-hole filling with minimal surface copper buildup for HDI technologies and thermal management of heat-sensitive electronics. The advantages of the single-step filling process benefit both the technology and the fabricator regarding the copper through-hole filling for the core.
Figure 19: New single-step through-hole filling.
Gerry Partida, Summit Interconnect
#902: Microvias: Is Your Product Reliability at Risk?
Partida’s presentation reviewed concerns and reliability testing of micro vias. He provided an overview of the HDI process and presented the use of current test methods and the superiority of testing with IPC-D-coupon and IPC-TM-650 test methods 2.6.7.2 and 2.6.27. He also discussed the warning statement in the forthcoming IPC-6012E (Qualification and Performance Specification for Rigid Printed Boards).
To emphasize his proposition, Partida presented test data from actual orders that showed that only these new IPC standards could detect all latent microvia defects. The higher temperatures of lead-free reflow are the main causes of this type of defect, and only four-wire testing at these temperatures will reveal them.
Figure 20: Detecting latent microvia failures in test.Page 6 of 7
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.