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Real Time with… AltiumLive 2020: The Need for Simulation in High-Speed PCB Design
October 6, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Andy Shaughnessy and Picotest Managing Director Steven Sandler discuss the panel that Steven will be participating in at AltiumLive 2020. The panel, led by Dr. Eric Bogatin, will feature co-panelists Heidi Barnes of Keysight Technologies, Rula Bakleh of Graphcore, and Istvan Novak of Samtec, who will discuss various ways to reduce signal and power integrity issues by using simulation, measurement, and other tricks of the trade. Steven also discusses his presentation on simulation, which focuses on SPICE simulation methods.
Visit Real Time with… AltiumLive 2020 to catch the latest video interviews and event-related content.
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BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
11/14/2024 | I-Connect007 Editorial TeamThe guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.
Smartphone Panel Shipments to Dip by 1.7% in 2025, with Chinese Manufacturers’ Share Expected to Exceed 70%
11/13/2024 | TrendForceTrendForce’s latest investigations reveal that while the overall smartphone market is projected to grow by just 3% in 2024, increased demand for refurbishes and second-hand devices is fueling growth in the smartphone panel market. Shipments this year are estimated to grow 6.7% YoY to reach 2.066 billion units.
Automating Test Processes in Modern PCBA Manufacturing
11/12/2024 | Josh Casper, Horizon SalesICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.
TTM’s Grand Opening in Malaysia
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Altus Sees Growing Interest for Laser Depanelling Solutions
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