-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor's Choice: Five Must-Reads for the Week
October 9, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It’s showtime! This past week, we saw quite a bit of news about virtual trade shows. It’s great to see show managers pivot from live, in-person events to virtual shows with only a few months to make it all happen. How would you like to be a show manager today?
We brought you complete coverage of this year’s virtual SMTA International and AltiumLive through our Real Time with… video program. And I-Connect007 is supporting the Additive Electronics TechXchange, which takes place on October 15.
We all miss the live interaction that an in-person event provides, but until the COVID-19 pandemic is resolved, we have other options. I’ve found it really easy to take notes during a virtual conference while sitting in my home office drinking coffee.
This year has been a learning experience for all of us. Is it 2021 yet?
Next week, Nolan Johnson will bring you his top five picks.
Real Time with… SMTAI 2020: Full List of Interviews With Industry Leaders
Published October 7
The virtual SMTAI 2020 show was a sort of “trial by fire.” SMTA pulled the plug on the in-person event over the summer, so show managers had just a few months to put a virtual event together. And they did a great job. We brought you complete coverage with our Real Time with… SMTAI 2020 program. Here’s a handy index of out SMTAI interviews.
Additive Electronics TechXchange Program Announced
Published October 6
I-Connect007 and SMTA have teamed up to bring you the Additive Electronics TechXchange on October 15. Check out this interview with ESI Automotive’s Lenora Clark and Omni PCB’s Tara Dunn, who discuss the technical program, which focuses on additive processes that enable line width and spaces down to five microns.
Real Time with… AltiumLive 2020: The Need for Simulation in High-Speed PCB Design
Published October 6
The virtual AltiumLive just wrapped up, and it was a real success. We have to hand it to Judy Warner and the rest of the Altium crew for making this happen. The audio was top-notch, and the video was as high-def as it could be—like looking through a window. We brought you full coverage with our Real Time with… AltiumLive 2020 program. Here is my interview with Steven Sandler, who spoke about the need for simulation, even though he makes money fixing designs that were not simulated. As one engineer said in Altium’s Discord chat room, “I don’t trust simulation. I only trust my measurements.” The problem is that no one else trusts your measurements.
Just Ask John Mitchell: The Exclusive Compilation
Published October 5
In the past, we brought you “Just Ask Happy Holden” and “Just Ask Joe Fjelstad.” Recently, we launched “Just Ask John Mitchell,” and we received all kinds of questions. Of course, some of the questions were critical of IPC, but John was happy to provide a response. Here is a handy collection of all of John’s questions and answers.
Pentalogix and Ucamco Announce Release of Pentalogix’s Gerber X3 Output
Published October 6
Sure, IPC-2581 and ODB++ get a lot of coverage. They’re hip and new (new compared to Gerber, anyway), and they may be the way of the future. But Gerber refuses to go quietly into the night, and for a good reason. At last count, about 95% of all designs are still output on Gerber, even if they’re also output on 2581 or ODB++. Now, Pentalogix has worked with Ucamco to extend Gerber’s functionality from design to EMS.
Suggested Items
IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.