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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Intellitronix Acquires Advanced Technology to Manufacture, Track Products
October 13, 2020 | Globe NewswireEstimated reading time: 1 minute
Intellitronix Corporation, a wholly-owned subsidiary of the US Lighting Group, Inc. and a leading manufacturer of automotive electronics, announced it has purchased the latest innovative Speed Print Technology 700 Series screen printer with bar code labeling capabilities to rapidly screen print and track circuit boards through its manufacturing process plus augment production times and improve quality control.
“Intellitronix is pleased to announce the acquisition of a faster and more accurate screen printer that incorporates a label identification system for processing electronic circuit boards. The company needed to drastically improve its production process, quality control, and product tracking. The circuit boards will have a scannable bar code label that will be used to track each circuit board through manufacturing, quality control, packaging, and shipping to the customer. The purchase of this advanced technology will bring added benefits to the company and its customers,” said Paul Spivak, CEO of the US Lighting Group. “Intellitronix and the US Lighting Group want to thank our shareholders for supporting us and believing in our competencies as an industry leader.”
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SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
Protecting Advanced Trucking Electronics in Harsh Environments
05/13/2026 | Beth Massey, MacDermid Alpha Electronics SolutionsFor decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.