-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Go Big: Limata’s X3000 Accurately Images Ultra-large, Flexible and Endless PCB Panels
October 22, 2020 | LimataEstimated reading time: 2 minutes

Limata, a provider of Laser Direct Imaging (LDI) systems for PCB manufacturing and adjacent markets, has launched the latest generation of its X3000 LDI system. This platform can handle the largest panels for dry-film patterning and solder mask imaging in PCB production without compromising on its highest precision standards in registration and resolution.
While standard PCB panel sizes have typically measured 24” x 18”, today there is an increasing demand for larger panels, often 24” x 36” or bigger, as well as a need to produce flexible PCBs in non-standard sizes. These large PCBs support a range of growing applications such as LED displays, 5G communications, aerospace and EV-automotive electronics. Using large PCBs instead of a combination of smaller boards delivers superior signal quality or lower signal attenuation in high frequency applications, while at the same time noticeably reducing assembly and installation costs.
Being able to handle large panel formats, up to 110" x 48", also means that the X3000 can simultaneously image multiple smaller PCBs in a single run, for example twelve standard 24" x 18" boards. This increases throughput, by reducing loading and unloading times, which further equates to reduced costs per panel. In addition, work processes can be set flexibly in manufacturing locations, since the X3000 can be loaded and unloaded from the front- and back-side.
"With the X3000, we have built an impressive system that can handle even the biggest oversize boards, whilst still retaining the outstanding accuracy of our X1000 and X2000 models," said Matthias Nagel, CTO of Limata. "In addition, the X3000 also supports roll-to-roll for the handling of endless flexible boards, with the largest PCB manufactured so far measuring 25 metres in length."
Auto-calibration
The X3000 model is market-proven and installed at multiple customer sites. This latest system generation further builds on the X-Series family's proven reliability, and utilizes an integrated auto-calibration system further delivering extremely high accuracy – unprecedented for a system of this size. The system improves registration quality with linear and nonlinear transformations, which are automatically applied in response to any distortion that it detects. In addition to PCB production, this accuracy makes the machine well-suited to applications such as chemical milling and industrial etching.
X3000 machine configurations are available with 2, 3 or 4 laser heads, providing a capacity of up to 24 ultra-violet (UV) lasers in total. A high resolution (HR) option provides an adjustable laser spot size for advanced HDI production, reliably handling dams and spaces down to 2 mil / 50 ?m. The platform uses cost-efficient high energy UV diode-lasers that achieve lifetimes (MTBF) of over 25,000 hours, thus further reducing TCO.
Faster solder mask imaging
Like all X-series system platforms from Limata, for solder mask direct imaging tasks the X3000 can also be equipped with Limata’s innovative LUVIR? technology, which uses a combination of UV and infrared (IR) lasers to reduce UV power consumption. Furthermore, this significantly increases the speed of solder mask (SM) direct imaging and achieves a TCO that is up to 40% lower than competing systems.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.