Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
SMTA Capital Chapter Hosts Webinar on Next-gen pH Neutral Cleaning Products
November 6, 2020 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is excited to host another free webinar on Friday, November 13. The webinar will include an informative presentation given by industry expert Ravi Parthasarathy of ZESTRON Corporation on “Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products.”
Electronic assemblies continue to grow more complex in terms of component design, board density, standoff heights, and increased use of sensitive material sets. Different market sectors may have unique materials sets that need to be considered when developing and/or selecting a chemistry for the cleaning process. These advances continually challenge the cleaning process. Often times, cleaning process improvement can be realized by increasing the cleaner mechanical energy through spray bar design, pressure and configuration, thermal energy by increasing the cleaning agent wash temperature, and chemical energy by increasing the cleaning agent concentration. However, chemical energy can also be increased through increased solvency of the cleaning agent itself.
The presentation will discuss the technical study done by Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Corporation and Terry Price, Ph.D, R&D Scientist, ZESTRON Corporation. In this study, two EMS companies explored alternate cleaning agent options in pursuit of continuous process improvement and meeting new product cleaning challenges. Each company was using an inline cleaner with a water-based cleaning agent and each had an optimized process that met their cleaning process requirements. However, they elected to explore the benefit of a cleaning agent with greater solvency to improve overall process efficiency and cleaning performance.
This presentation reviews their current cleaning process as well as presents field data detailing the cleaning process performance improvements and resulting cleanliness levels achieved on complex electrical assemblies using a cleaning agent with greater solvency. Examples of the new challenges will be discussed, and the resulting field data detailed.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Alternative Manufacturing, Inc. (AMI) Announces Commitment to Excellence in Industrial, Defense, Aerospace, Renewables, and Robotics Markets
09/16/2025 | Alternative Manufacturing, Inc.Alternative Manufacturing, Inc. (AMI), a 100% employee-owned contract manufacturer, proudly reaffirms its leadership in the electronics manufacturing services (EMS) industry with a continued commitment to delivering high-quality PCBAs and box builds across the industrial, defense, aerospace, renewable energy, and robotics markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.