-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Just Ask Tara Dunn: Why Don’t Fabricators Provide More Feedback to Designers?
November 10, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. She is also co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”
Q: Why don’t flex and rigid fabricators provide more feedback to designers, especially if it’s not good design and engineering work?
A: This is an interesting question. My initial tongue-in-cheek reaction was that fabricators are not often asked to provide feedback. In my experience, fabricators are very willing to provide feedback on PCB design, flex or rigid, and that conversation is something that I would always encourage. These conversations are always more impactful when fabricators are involved early in the design process.
Discussions about stackup and design for manufacturability concerns—especially for designs pushing the limits on multiple different fabrication parameters that require trade-offs—or for designs with concerns about flexibility and robustness of a design are critical and can have a significant impact on cost and reliability.
Unfortunately, with the rapid pace of the industry, those conversations often happen only after a design is complete and sent to the fabricator for manufacturing. At that point in the process, time deadlines often loom, and it can be time-consuming and expensive to rethink that design to improve manufacturability.
I would challenge both designers and fabricators to take a step back and find ways to better communicate about DFM issues early in the process. There is a lot of great content available, but that cannot replace conversation, or even a facility tour, as a learning tool. Reach out to your fabricators early in the design and ask their opinion.
To submit your questions for Tara, click here.
Suggested Items
HyRel Technologies Celebrates Future Innovators: Intern Program Empowers the Next Generation of Engineers and Professionals
05/01/2025 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Siemens Expands Global Electronics Intelligence Reach and Supplyframe Portfolio with Wevolver Acquisition
04/30/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced its intention to acquire Wevolver, expanding its audience reach, enhancing the Supplyframe product portfolio, and combining digital marketing and integrated campaign programs that include go-to-market support and content creation.