Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Lone Star Circuits Completes Sale to Majority Stockholders
November 12, 2020 | Lone Star CircuitsEstimated reading time: Less than a minute
It is with appreciation to announce that the founder of Global Innovations, Best Circuit Boards Dba Lone Star Circuits, Inc. has sold the remaining interest in the organization to the Majority Stockholders. The aforementioned, is the result of a well-planned transition of the controlling interest in the company, that will provide the cornerstone for the facilitation and execution to the overwhelming/continued demand for Lone Star’s products and services.
“To be debt free, coupled with a concentric/astute leadership team allows LSC to realize the significant opportunities that the company has earned, as well as establishing a solid foundation for future acquisitions, with respect to capital and or other PCB organizations is truly exciting/reassuring,” said Lance Riley President/COO of Lone Star Circuits, Inc.
Mr. Riley continued, “Given LSC’s role/responsibility as a trusted source of supply for high reliability PCBs, the company’s financial position is commensurate to the ongoing/evolving requirements of our customers and the markets that we serve. With that said, LSC’s compliance to the NIST 800-171 and CMMC Level 3 is a testament to the organizations commitment in securing the future business landscape.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.