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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Pegmatis Provides Product Development Consulting Services
November 17, 2020 | PegmatisEstimated reading time: Less than a minute
Pegmatis, an elite product design, and development services company, is pleased to offer consulting services for new product development. The company's seasoned team of professionals performs due diligence and assessments on behalf of investors or inventors looking for viability assessments.
There is more to launching a successful project than the technical design. Pegmatis will perform an unbiased review of an organization's development and design structure: from skills to tools and processes. The team will highlight any gaps and propose solutions.
“Our customers typically engage us to evaluate several possible architectures and to design a solution that significantly reduces costs on critical and complex design projects,” commented Andrew Taylor, Director at Pegmatis.
Pegmatis' focus on the hardware, software, and manufacturing aspects of bringing a product to market is also valuable to customers looking for a product refresh. The Pegmatis proven design approach comes from many years of experience launching high quality, integrated products into mass production with Fortune 1000 organizations.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.