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Pegmatis Provides Product Development Consulting Services
November 17, 2020 | PegmatisEstimated reading time: Less than a minute
Pegmatis, an elite product design, and development services company, is pleased to offer consulting services for new product development. The company's seasoned team of professionals performs due diligence and assessments on behalf of investors or inventors looking for viability assessments.
There is more to launching a successful project than the technical design. Pegmatis will perform an unbiased review of an organization's development and design structure: from skills to tools and processes. The team will highlight any gaps and propose solutions.
“Our customers typically engage us to evaluate several possible architectures and to design a solution that significantly reduces costs on critical and complex design projects,” commented Andrew Taylor, Director at Pegmatis.
Pegmatis' focus on the hardware, software, and manufacturing aspects of bringing a product to market is also valuable to customers looking for a product refresh. The Pegmatis proven design approach comes from many years of experience launching high quality, integrated products into mass production with Fortune 1000 organizations.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.