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EMA Design Automation Expands Operations in North America
November 18, 2020 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation®, a full-service provider and innovator of Electronic Design Automation (EDA) solutions, announced it is expanding operations in North America through the addition of the Trilogic EDA engineering sales and support team. This announcement marks EMA's continued growth and commitment to bring leading-edge technology and first-class support to the EDA market.
“We continue to see strong demand from customers looking to accelerate their digital transformation, as engineering teams adapt to increasing competition and shrinking time to market windows,” said Manny Marcano, president and CEO of EMA Design Automation. “As we grow, EMA is committed to maintaining the highest level of customer-centric services for our clients. With this mindset and mission, we will continue to positively influence the EDA market.”
In 2020, EMA has seen a tremendous amount of growth, largely due to the increased customer need for automation and ability to deliver first-pass success through digital prototyping. This growth is projected to continue throughout 2021 and beyond. To meet demand, EMA is adding a team of experienced EDA sales and support personnel from Trilogic EDA, whose 30 years of knowledge will be invaluable. In support of this expansion, EMA will also be opening a new regional office in Andover, MA, enabling further personalized support in the region and leveraging the Trilogic EDA team's exemplary reputation to foster relationships with both new and existing customers.
“Trilogic and EMA share a similar company culture, vision, and more than 30-year history of success in the EDA market. EMA's EDA products will seamlessly fit in with existing Trilogic customers,” said Brad Paul, founder and CEO of Trilogic. “Trilogic brings additional technical expertise, an understanding of evolving business needs, and formidable customer relationships. We are delighted to be joining EMA.”
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.