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Lee Ritchey Discusses His ‘Homemade’ NASA Board
November 26, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In this audio interview, Lee Ritchey shares a story about his favorite PCB design—a board that he built on his kitchen table early in his career for a radio used on the Apollo 11 spacecraft. Lee explains how he ended up working on this design as a young engineer, as well as the excitement that he felt watching Apollo 11 land on the moon while carrying his PCB. He also jokes about why his wife was less than pleased with his handiwork when he drilled holes in the board on the kitchen table.
To download this audio (mp3) file, click here.
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ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.