-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Fujitsu Develops Virtual Router Acceleration
November 27, 2020 | ACN NewswireEstimated reading time: 2 minutes
Fujitsu Laboratories Ltd. announced the development of technology to accelerate virtual routers, which play a major role in the functionality of networks in virtual environments.
Server virtualization, which concentrates multiple applications and the infrastructure functionality of network processing in a general-purpose server environment, is spreading beyond datacenters to the field of edge computing, including wireless base stations and Mobile Edge Computing (MEC)(1). The technology also proves useful in areas including societal infrastructure with applications like traffic management, and in entertainment, where it can be used to deliver viewers content like sporting events. As data volumes increase and systems become increasingly complex, however, the CPU resources required for packet processing in a virtual network increase. This reduces the number of applications that can run on a single server, and leads to lower server aggregation rates.
To resolve this issue, Fujitsu Laboratories has now developed technology to accelerate packet address control, which had been a performance bottleneck, while also offloading the processing of router functions in the virtual network to field programmable gate arrays (FPGAs)(2). This speeds up packet processing performance eighteen-fold compared with existing virtual routers, while reducing the use of CPU resources to about one thirteenth that of existing technology.
With this technology, Fujitsu Laboratories will deliver high performance virtual networks with a low computational burden, supporting the digital transformation of companies by improving server utilization efficiency for businesses that will use large volumes of data in the 5G era.
Development Background and Issues
Server virtualization, which concentrates multiple applications and network processing functionality using a virtual environment on a general-purpose server, is becoming increasingly common and widespread as digital transformation progresses. Moreover, by accelerating digital transformation within a wide variety of companies, new services are also being created that link applications together. Against this background, the volumes of data handled by these applications is trending upwards, leading to issues of increasing network complexity and increased computational burdens.
As networks grow increasingly complex and computational burdens increase, issues have arisen with improving packet processing performance in the virtual routers that are essential to flexible network structures, as well as with reducing the CPU resources used for network processing, in the effort to deliver efficient server virtualization. By resolving these issues, it will become possible to increase the number of applications that can run on a server, as well as decrease the number of servers needed for a system, reducing investment costs for customers.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Circus SE Set for High-Volume Market Entry in the Defense Sector
10/17/2025 | BUSINESS WIRECircus SE a global technology leader in AI robotics for autonomous nutrition systems and troop supply, is expanding its global production network as part of its high-volume market entry into the defense sector.
China Expands Rare Earth Export Restrictions, Tightening Grip on Global Supply Chains
10/16/2025 | I-Connect007 Editorial TeamChina sharply expanded its rare earth export restrictions on Oct. 9, adding additional elements and refining technologies to its control list while imposing stricter rules on foreign users in the defense and semiconductor industries.
SAMI Advanced Electronics Company Launches “Remal” Computer Manufacturing Project in Partnership with HP and Foxconn
10/15/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC), a wholly owned subsidiary of Saudi Arabian Military Industries (SAMI), proudly announced the launch of the “Remal” project for computer manufacturing, in strategic partnership with HP and Foxconn.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.