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Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Use of IMS Thermal Materials in Multilayer Stackups for Power Applications
December 1, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The dissipation of heat from electronic power modules is increasingly critical to maintain their functionality and increase their reliability. Insulated metal substrates (IMS) offer a proven route to thermal management, and this specialist technology is increasingly employed in multilayer stack-ups for power applications.
This Realtime with... I-Connect007 roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer. The benefits of technical and engineering support from a one-stop laminate supplier become clearly apparent.
To download the audio of this roundtable discussion (mp3) file to listen on the go, click here.
To download the PDF transcript booklet of this rountable, click here.
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