Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
December 2020 Issue of Design007 Magazine Available Now
December 9, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
What if every OEM in the world reduced its PCB design respins by just one? What would that save, not just in wasted revenue, but in other resources like hours or time to market? It's impossible to say, but we're clearly talking about hundreds of millions of dollars worldwide—just from reducing respins by one. If you can reduce your respins by one, couldn't you eventually eliminate them altogether?
In the December issue of Design007 Magazine, we delve into the idea of reducing respins through solid DFM techniques. Download your copy today on the virtual newsstand or subscribe here for delivery in your email inbox.
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