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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 11, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.
While the Editor’s Choice: Five Must-Reads this week might not be quite so ballistic as the mainstream, we had some big news, nonetheless. Here are the five news bombshells that we think deliver the biggest impact in electronics manufacturing this week.
ECWC15 Virtual Conference Keynote: 5G PCB Technology and Material Challenges
Published December 7
Even while under pandemic lockdown in the UK, I-Connect007 Technical Editor Pete Starkey took advantage of the virtual ECWC15 format to attend a keynote from Dr. Shiuh-Kao Chiang, managing partner of Prismark, describing the PCB technology and material challenges presented by the introduction of the fifth-generation cellular wireless communication network—the roll-out of which was continuing in spite of the coronavirus pandemic. Readers, understandably, flocked to Pete’s coverage of this important, but often hard-to-access industry conference.
IPC APEX EXPO 2021 Goes Virtual
Published December 8
We all secretly hoped that the timing would be such that IPC APEX EXPO 2021 would be the bookmark to the pandemic, which started just after the 2020 EXPO, and an ending would allow the 2021 version to proceed. Choosing a prudent path, IPC pivots APEX EXPO to a virtual event.
Chapter 1 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
Published December 8
The micro I-007e book recently published by Anaya Vardya at American Standard Circuits, third in their series, is drawing significant readership. And this excerpt published in the Daily Newsletter did as well.
Training Is Hard, But It’s Also Soft
Published December 8
Blackfox’s Jahr Turchan encourages readers to look at workforce training not only from a certification perspective, but also from a people skills point of view–something that seems to resonate with readers as we all learn new ways to collaborate with our project teams and coworkers.
Special Operations Strives to Use the Power of Artificial Intelligence
Published December 8
From the article, “Project Maven was initially executed to automate the processing and exploitation of full-motion video collected by intelligence, instead of relying on humans to sort through all of it. With AI's ability to sift quickly through terabytes of data to find relevant pieces of intelligence, it allows the human to make faster and better informed decisions.”
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Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
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OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.