-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Mentor, a Siemens Business, Announces 28th PCB Technology Leadership Award Winners
December 11, 2020 | Mentor, a Siemens businessEstimated reading time: 2 minutes

Mentor, a Siemens business, recently announced the winners for its 28th printed circuit board (PCB) Technology Leadership Awards. Established in 1988, this program is the longest-running competition of its kind in the electronic design automation (EDA) industry. The program recognizes engineers and designers who use innovative methods and design tools to address highly complex PCB system design challenges and produce industry-leading products.
Prominent experts in the PCB industry judged entries from around the world in categories representing a wide variety of markets and industries, including:
- Computers, blades and servers, memory systems
- Consumer electronics and handheld designs
- Industrial control, instrumentation, security and medical applications
- Military and aerospace solutions
- Telecom, network controllers, line cards
- Transportation and automotive designs
The PCB Technology Leadership Awards contest is open to any designs created with Mentor PCB solutions. Judging is based on design complexity and overcoming associated challenges, such as small form factors, high-speed protocols, multi-discipline team collaboration, advanced PCB fabrication technologies, and design-cycle time reduction.
The panel of expert judges this year included Dr. Rajan Bedi, Spacechips CEO and founder; Stephen Chavez, Collins Aerospace staff engineer and global technical lead, CID+; Michael R. Creeden, Insulectro technical director design education, CID+; Gary Ferrari, FTG Circuits technical support director; Rick Hartley, RHartley Enterprises principal engineer; Steve Herbstman, SHLC founder and lead designer; Happy Holden, Gentex Corporation (retired); Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; and Susy Webb, Fairfield Nodal senior PCB designer.
2020 Technology Leadership Award Winners
Best Overall Design
- Company: Infinera
- Design team: Infinera & Jabil Team
- Using: Xpedition™ Enterprise software
- Computers, Blade & Servers, Memory Systems
- Company: ZTE
- Design team: Zhang Meijuan, Guo Qian, Yao Xueying, Fan Xiaxia, Meng Liqiang, Ao Xiaodong & Zhang Hailong
- Using: Xpedition Enterprise
- Consumer Electronics & Handheld
- Company: Tessolve Semiconductor
- Design team: ATE Design Team
- Using: Xpedition Enterprise
- Industrial Control, Instrumentation, Security & Medical
- Company: CiBOARD electronic
- Design team: Thomas Blasko & Michael Schwitzer
- Using: Xpedition Enterprise
- Military & Aerospace
- Company: Abaco Systems
- Design team: Jim Rose, Rob Savage, James McDonald & Martin McGregor
- Using: Xpedition Enterprise
- Telecom, Network Controllers, Line Cards
- Company: Sienna Ecad Technologies
- Design team: Rajkumar Ramadoss, Narasimha Rao & Vijayakumar K
- Using: Xpedition Enterprise
- Transportation & Automotive
- Company: Nobo Automotive Systems
- Design team: Li Yue, Wang Zelong, Huang Wenjuan, Cheng Xunzhuang, Lu Shuai & Tong Qi
- Using: Xpedition Enterprise
Honorable Mention
- Company: Adcom
- Design team: Moshe Frid, Greg Kaplan, Galya Makloof, Boris Abramovich, Tamir Yampolsky & Haim Anava
- Using: Xpedition Enterprise
- Company: Honeywell Technology Solutions Lab
- Design team: Siddanagouda Bhasagi, Veeresh Goure & Mayank Bhaintwal
- Using: Xpedition Enterprise
- Company: Tessolve Semiconductor - 1271
- Design team: SathishKumar Kalaiselvan, Manikandan Ravi, Karthick Sathiyaseelan & Kishore Subramani
- Using: PADS™ software
- Company: Honeywell Technology Solutions Lab - 1322
- Design team: Mayank Bhaintwal, Veeresh Goure & Siddanagouda Bhasagi
- Using: Xpedition Enterprise
About Mentor Graphics Corporation, a Siemens business
Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Website: http://www.mentor.com.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.