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Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.

The Test Connection Inc. to Exhibit at Keysight User Group Mexico 2026

08/07/2026 | The Test Connection Inc.
The Test Connection Inc., a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce its participation in the Keysight User Group Mexico, taking place on August 20, 2026, in Guadalajara, Jalisco, Mexico.

SAIC Awarded New $70M Task Order for DoW Radar Engineering and Technical Support Services

08/04/2026 | SAIC
Science Applications International Corp. has been awarded a new $70 million task order by the U.S. Navy to provide advanced technical skills, analysis, engineering studies, modeling, and simulation of radar systems to the Radar Technologies Division of the Naval Surface Warfare Center (NSWC) Crane Division.

Siemens Launches SIMATIC AX WinCC Unified Elements

07/31/2026 | Siemens
Siemens—a global leader in industrial AI and automation technology—announced the launch of SIMATIC AX WinCC Unified Elements, an IT-like engineering application for the SIMATIC WinCC Unified system.

Qnity, University of Delaware Partner on Manufacturing Innovation

07/31/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced a strategic partnership with the University of Delaware College of Engineering (UD Engineering) designed to strengthen the engineering talent pipeline, expand research collaboration, and accelerate innovation in advanced manufacturing.
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