-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials
January 14, 2021 | MacDermid Alpha Assembly DivisionEstimated reading time: 1 minute
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Both ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills which are designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CU21-3240 exhibits good thermal cycling performance due to its low coefficient of thermal expansion. It is suitable for applications with high reliability requirements such as automotive. ALPHA HiTech CU31-2030 is a low viscosity underfill which enables fast and efficient flow properties. It is suitable for assembling BGA, CSP and Flip Chip devices and is also suitable for rework.
ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable cornerfill. It is an epoxy-based material to be dispensed on the corner (corner bonding) or edges (edge bonding) of BGA devices. Upon completion of the curing process, the cured cornerfill helps to strengthen the soldered assembled component allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT). The product is also reworkable.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Suggested Items
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
KYZEN’s Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference
05/07/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced today that KYZEN’s Director of Science, Adam Klett, PhD will present as a keynote speaker at the SMTA Electronics in Harsh Environments Conference. The event is scheduled to take place May 14-16, 2024 at the Technical University of Denmark in Copenhagen, Denmark.
Altus Equips SSTL with Advanced Cleaning Technology for Electronics
05/07/2024 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics manufacturing industry, has announced the successful installation of an advanced PCBA cleaning system at Surrey Satellite Technology Limited (SSTL).
GPV's Handover of Refurbished Factory Building
05/07/2024 | GPVOn 6 May 2024, Bjorn Fiskers, MD at GPV Electronics TH in Thailand and his team were handed the keys to our refurbished factory building, adding another 7,000 sqm to our current 15,000 sqm electronics factory. Our electronics factory in Thailand will comprise of a total of 22,000 sqm.
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.