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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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January 2021 PCB007 Magazine Available Now
January 18, 2021 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In the January issue of PCB007 Magazine, we kick off our coverage of continuous improvement, a topic that we'll be focusing on throughout 2021. We’ll be exploring smarter processes, smarter equipment, automation, and operational efficiencies. We will consider “X = Xc - 1” from all angles. This month, we begin by establishing why continuous improvement, in the form of smarter processes, is so critical to our industry.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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Brent Fischthal - Koh YoungSuggested Items
TLT Electronics Officially Opens Facility in Vietnam
05/06/2026 | TLT ElectronicsLithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/17/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/16/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Elsyca Acquires Hivelix to Strengthen Simulation Platform for Electrochemical Surface Engineering
04/03/2026 | ElsycaElsyca, a global pioneer in computer-aided engineering (CAE) simulation for electrochemical processes and surface finishing, announces the acquisition of Hivelix, a specialist in advanced surface treatment simulation with strong expertise in multiphysics modelling and AI-assisted process optimisation.
New IPC Standards Released
02/23/2026 | Global Electronics AssociationEach quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.