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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Futurist, Writer and Manufacturing Tech Expert Travis Hessman to Keynote IPC APEX EXPO 2021
January 18, 2021 | IPCEstimated reading time: 2 minutes
Each year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2021 will feature IndustryWeek Editor-in-Chief Travis Hessman. During his keynote on March 10, Hessman will present, “The Great Digital Transformation.”
Hessman will educate keynote participants on the process undertaken by some of today’s most successful companies and what they are doing to transform a dizzying array of technologies such as connected machine-to-machine systems, machine learning and artificial intelligence into actionable, effective digital strategies. In addition, he will cover how they achieved greater operational efficiency and launched new products faster while improving product quality across their businesses.
Guided by Hessman, participants will navigate a roadmap to digital transformation that can help move their companies from the sidelines to the heart of the Factory of the Future -- The Industry 4.0 revolution.
As chief editor of IndustryWeek, Hessman offers a unique perspective on the digital manufacturing revolution as he is in daily contact with some of the world’s most successful and innovative manufacturers who are immersed in real-life implementation, application, and strategies for digital transformation success. His presentation will mix these perspectives with his background as a teacher, a mentor, and a writer to create a powerful storytelling experience that crafts a distinct narrative to help cut through the noise and hype and drive real progress for the industry. Later in the afternoon, Hessman will conduct a live, one-hour Q&A session with attendees who will have the opportunity to pose their own questions on digital transformation.
Hessman’s keynote is free to all IPC APEX EXPO participants. In addition to Hessman’s keynote, John Mitchell, IPC president and CEO and Shawn DuBravac, IPC chief economist, will deliver keynotes on March 8 and 11, respectively. The virtual conference, courses and online exhibition will run March 8–12, 2021. For more information on schedule and registration options, visit www.IPCAPEXEXPO.org.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.