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High Density Packaging User Group Announces Nippon Denkai Membership
January 27, 2021 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that Nippon Denkai has become our newest member.
“Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity.”, said Michael Coll, COO at Denkai America.
“It is an honor and a privilege to have Nippon Denkai join the outstanding companies working on HDP User Group projects. Their expertise and capability in copper foil manufacturing will contribute significantly to several of our projects, such as our copper surface vs. loss project, which is focused on high-speed signal integrity”, said Larry Marcanti, Executive Director of HDP User Group.
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