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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cadence Announces $5M Endowment at Massachusetts Institute of Technology
February 2, 2021 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. has announced the establishment of the Cadence Design Systems Professorship Fund for the Massachusetts Institute of Technology (MIT) Stephen A. Schwarzman College of Computing.
The $5M fund will enable the college to establish a full professorship for outstanding faculty with research and teaching interests in the fields of artificial intelligence (AI), machine learning (ML) or data analytics and can also provide career development opportunities for rising stars doing cutting-edge research in these areas.
“We’re delighted to support MIT’s efforts to advance innovation in the exciting fields of AI, ML and data analytics,” said Lip-Bu Tan, chief executive officer of Cadence. “These transformative technologies are key to the computational software industry and Cadence, and we look forward to enabling the acceleration of MIT’s groundbreaking research in these areas. I was very fortunate to have obtained my master of science degree in nuclear engineering from MIT where I focused my studies on system simulation analysis, so this endowment is very personal to me.”
“Scholars within the MIT Schwarzman College of Computing are at the forefront of computing research and education. Cadence’s generous gift is providing vital new resources for the college in supporting these faculty as they deliver the latest advances in computing and AI,” says Daniel Huttenlocher, dean of the MIT Schwarzman College of Computing. “I’m extremely grateful to Cadence for their contribution and commitment to MIT and the college.”
Establishing the new fund at MIT is part of Cadence’s overall commitment to advancing education and fostering innovation in the burgeoning fields of AI, ML and data analytics.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
NVIDIA, Corning Partner to Boost U.S. AI Manufacturing
05/06/2026 | BUSINESS WIRENVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.