-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Customers Experience Speed Increases of up to 80% on PCB Designs Using Pulsonix 11.0
February 9, 2021 | PulsonixEstimated reading time: 2 minutes

Pulsonix, the electronic design automation (EDA) company delivering technology-leading PCB design solutions, has announced the release of Pulsonix version 11.0, which offers significant speed improvements by using the latest technologies available, as well as the introduction of new functionality for high-speed designs.
“Many of our customers are building significantly more complex designs resulting in the need for fast and efficient PCB design tools, ” said Bob Williams, marketing director for Pulsonix. “Version 11.0 makes a gigantic leap in speed, dramatically reducing the time it takes to perform many PCB design operations, such as design rule checking (DRC), copper pouring, and Gerber generation.”
Significant speed improvements have been made by completely rewriting the underlying graphics engine to utilize the standard DirectX graphics and high-performance graphics cards such as those used in the gaming industry. “With these changes, some of our large designs are displaying up to 2.5 times faster,” said Olaf Hollinger at Carl Zeiss AG. In addition, multi-threading capabilities have been extended and added to many functions, meaning that speed is significantly increased on features that are processor intensive and that can utilize parallel processing.
“We've seen many improvements in this area,” added Hollinger. “As an example, we've seen DRCs that can be more than four times faster with multi-threading using my eight cores.” In addition to the speed advantage, the new graphics also improve the rendering quality of the design image being viewed.
Some of the other enhancements to version 11.0 include:
- Same Net Via to SMD Check - This feature helps avoid technological problems during soldering of SMD components by ensuring a sufficient solder mask bridge between SMD pads and vias.
- Back Drilling for High-Speed Designs - Using an easily created rule set, back drilling can be defined for critical nets that require the removal of unwanted via or component pin stubs on through-holes. This can significantly reduce signal integrity issues and signal distortion.
- Differential Pair Rules - The ability to create differential pairs from rules automates a typically manual and time-consuming process, especially when working on designs with hundreds of differential pairs.
- Creepage Rules - These were introduced to calculate creepage paths for critical nets. This is needed to validate safety rules for specific designs, e.g., in medical devices.
- Extended Character Set (Unicode) - Extended character and internationalization support using the Unicode standard has been added, as well as character sets for languages such as Chinese, Japanese, and Korean.
“Version 11.0 is a remarkable step forward regarding performance and speed, which is very important for large designs,” added Hollinger.
About Pulsonix
The Pulsonix highly productive EDA technology suite has been designed to meet the ever-changing needs of PCB design in the 21st century and sets the new standard for the electronics industry with easy-to-use and learn schematic capture and PCB layout programs. The software engineering professionals at Pulsonix understand the need for high quality and fast response times, and use the very latest software writing techniques in graphics and data handling to produce best-in-class tools. Pulsonix was founded in 2001 and is a division of WestDev Ltd. Visit Pulsonix at www.pulsonix.com for more information.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.