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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Ultra Librarian Adds STMicroelectronics Reference Designs in Cadence System Design Formats
February 16, 2021 | Ultra LibrarianEstimated reading time: 1 minute
Ultra Librarian, the world's largest free cloud-based CAD library provider, has announced the addition of 25 authorized STMicroelectronics interactive reference designs in Cadence system design formats, now available for download via Ultra Librarian. “These authorized reference designs from ST in Cadence system design formats, combined with CAD models from Ultra Librarian, jumpstart the design process,” said Manny Marcano, president and CEO of EMA. “This eliminates the tremendous number of hours typically spent recreating a design from a PDF and sourcing relevant parts.”
Reference designs provide engineers with a valuable tool allowing them to see parts in action, which accelerates the design process and brings ideas to life faster. These designs have been built, tested, and authorized by the manufacturers and verified by Ultra Librarian to ensure accuracy of the design and associated models. Each download comes with a complete Bill of Materials ready for purchasing.
“Delivering reference designs in Cadence Allegro and OrCAD formats eliminates the need to manually recreate design artifacts from reference documents, accelerating design creation across the system designer ecosystem,” said Saugat Sen, vice president of R&D in the Custom IC & PCB Group at Cadence. “With reference designs available on Ultra Librarian, designs can be downloaded in Cadence system design formats along with all associated CAD models.”
“ST has teams of engineers focused on developing tools, reference designs, and evaluation boards to kick start customers' system design,” said Alessandro Cremonesi, chief innovation officer and SRA group general manager at STMicroelectronics. “The full range of cooperation arrangements we've made, with companies like Ultra Librarian, are geared to ease and accelerate product development to shrink customer time-to-market across a broad range of applications for an even quicker and more seamless route to sales.”
The 25 reference designs from ST include a complete solution for three-phase AC/DC and DC/AC applications. These designs are based on a digital platform optimized for power conversion, a wireless multi-sensor-node development kit and reference design for Industrial IoT (IIoT) applications, and a high-current inverter for automotive 3-phase BLDC motor-control applications.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.