IDEX Biometrics Further Strengthens its Supply Chain by Partnering with MFLEX
March 3, 2021 | Globe NewswireEstimated reading time: 1 minute

IDEX Biometrics ASA, a leading provider of advanced fingerprint identification and authentication solutions, has signed an agreement with Multi-Fineline Electronix, Inc. (MFLEX), a subsidiary of Suzhou Dongshan Precision Manufacturing Co., Ltd. (DSBJ), and a leading global provider of high-quality, technologically advanced flexible printed circuits and assemblies. The agreement forms a key part of IDEX’s mass production ready supply chain, essential to meet the growing demand for biometric payment cards.
Under the agreement, MFLEX will provide flexible printed circuit assemblies for IDEX’s biometric payment card reference design. This reference design is the only biometric smart card reference design that has been used in cards certified by China UnionPay. MFLEX has received an initial order from a Tier 1 card manufacturer.
“Developing an end-to-end supply chain for biometric card manufacture is critical to accelerating the development of biometric cards by card producers,” said Reza Meshgin, CEO, MFLEX. “This allows card manufacturers to focus on their competences such as lamination, embedding, and personalization, and streamlines the card development and go-to-market processes.”
“As we establish a supply chain that is mass-production ready, we are pleased to have signed this agreement with MFLEX, a global leader in its field. This agreement allows card manufacturers to have instant access to high-quality flexible printed circuit boards in the required large quantities,” said Vince Graziani, CEO, IDEX Biometrics.
Suggested Items
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse Design: Constraints for the Next Generation
07/16/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.
Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg
07/15/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Derek Rossberg as Regional Business Development Manager.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.