Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Cicor Welcomes OEP as New Major Shareholder
March 3, 2021 | CicorEstimated reading time: 1 minute
Cicor, a leading international technology company in the fields of printed circuit boards and hybrid circuits, printed electronics, microelectronics as well as EMS (electronic manufacturing services), based in Boudry (Switzerland), has been informed that HEB Swiss Investment AG, Zurich, has sold all of its shares in Cicor Technologies Ltd. in a binding transaction to an investment vehicle of One Equity Partners (OEP).
HEB Swiss Investment AG had been a major shareholder of Cicor Group since March 2009 and held approximately 29.35% of the shares as of December 31, 2020.
One Equity Partners (OEP) is a middle market private equity firm with over $8 billion in assets under management focused on transformative combinations within the industrial, healthcare and technology sectors in North America and Europe.
Cicor welcomes OEP as a new major shareholder of Cicor Technologies AG. The Board of Directors thanks the long-time major shareholder HEB for its loyalty during the development of Cicor into an operationally and financially robust and fast-growing technology company. Now a new chapter in Cicor's development towards a leading European manufacturer of high-tech electronics begins and the Board of Directors looks forward to working with OEP as a strong partner in the interest of all Cicor's stakeholders.
The closing of the transaction is subject to customary regulatory approvals.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.