Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
March 2021 Issue of Design007 Magazine Available Now
March 8, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Keeping bad data out of your design involves a lot of detective work. Designers and design engineers need to assess the accuracy and completeness of data at every step of the design process. If one small error in a footprint or schematic goes unnoticed, the CAM engineer may be calling with bad news on Friday afternoon. So, in the March issue of Design007 Magazine, we asked our expert contributors to discuss their special operations and tactics for keeping bad data out of their designs.
Download your copy today on the virtual newsstand or subscribe here for delivery in your email inbox.
Share on:
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in